Merkmale: High Endurance Technology (HET), Temperature Monitoring and Logging, Enhanced Power Loss Data Protection, End-to-End-Datenschutz, 3D NAND Technology
Schnittstelle: U.2 PCIe 3.1 x4 (NVMe)
Formfaktor: 2.5" (6.4 cm)
NAND-Flash-Speichertyp: 3D triple-level cell (TLC)
Merkmale: High Endurance Technology (HET), Temperature Monitoring and Logging, Enhanced Power Loss Data Protection, End-to-End-Datenschutz, 3D NAND Technology
Schnittstelle: U.2 PCIe 3.1 x4 (NVMe)
Formfaktor: 2.5" (6.4 cm)
NAND-Flash-Speichertyp: 3D triple-level cell (TLC)
Merkmale: High Endurance Technology (HET), Temperature Monitoring and Logging, Enhanced Power Loss Data Protection, End-to-End-Datenschutz, 3D NAND Technology
Schnittstelle: U.2 PCIe 3.1 x4 (NVMe)
Formfaktor: 2.5" (6.4 cm)
NAND-Flash-Speichertyp: 3D triple-level cell (TLC)
Merkmale: High Endurance Technology (HET), Temperature Monitoring and Logging, Enhanced Power Loss Data Protection, End-to-End-Datenschutz, 3D NAND Technology
Schnittstelle: U.2 PCIe 3.1 x4 (NVMe)
Formfaktor: 2.5" (6.4 cm)
NAND-Flash-Speichertyp: 3D triple-level cell (TLC)