Merkmale
Temperatursensor, stoßfest, TRIM-Unterstützung, End-to-End-Datenpfadschutz, aufrüstbare Firmware, Optimal Data Flow, 3D NAND Technology, Global Wear Leveling, SLC-Cache, ECC Recovery LDPC, NVM Express (NVMe) Deallocate Support, L1.2 Energiesparmodus, NVM Express (NVMe) 1.4, NVMe Security Erase Support, MEDS (Mushkin Enhanced Data-protection Suite), IG5236 Controller, 512 MB DDR4 DRAM Cache, S.M.A.R.T.
