Merkmale
Temperatursensor, stoßfest, TRIM-Unterstützung, End-to-End-Datenpfadschutz, Optimal Data Flow, 3D NAND Technology, Global Wear Leveling, SLC-Cache, ECC Recovery LDPC, NVM Express (NVMe) Deallocate Support, L1.2 Energiesparmodus, Unterstützung von HMB (Host Memory Buffer), NVM Express (NVMe) 1.4, NVMe Security Erase Support, MEDS (Mushkin Enhanced Data-protection Suite), InnoGrit IG5216, S.M.A.R.T.
